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You are here: Home » Products » High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting
High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting
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Product: Views:146High-frequency Spindles For Wafer Dicing Or Silicon Plate Cutting 
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Delivery date: Since the payment date Days delivery
Valid until: Long-term effective
Last updated: 2017-12-07 03:33
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High-frequency spindles for cutting performanceZYS high-frequency spindles for wafer dicing use air static pressure bearings,Website:://.zys-bearing.com, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.ParametersTypeSpeedr/minKWVoltageVCurrentAFrequeceHz92GD40Q400000.752202.666680GD30Q300000.51652.5500
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